Nvidia
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Nvidia lines up 2.5x substrate capacity and 300% more packaging by 2028
On 21 October 2026, at GTC Berlin, NVIDIA named six partners — Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, Siliconware Precision Industries (SPIL)…
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Nvidia packs an AI data center into a container, claiming a 14-day on-site build
Nvidia's latest data center product ships as a container. At the Berlin GTC keynote on 21 October, Jensen Huang introduced DSX POD: a factory-built module…